Polyurethane formulations are the most common materials used for potting and encapsulation of electronic components.  Polyurethane compounds are available in a very wide range of hardnesses, with many different properties, from very soft to very rigid and for low and high temperature respectively. There are products with fire protection classification according to UL94-V0 and EN45545 and thermally conductive in a number of different heat classes. Transparent materials for LED applications are also available.

Due do their complex versatility and ease of use, polyurethanes are covering a very wide rage of potting and encapsulation applications in the electronic, automotive, rail, marine and transport industries.

Key Features:

• High adhesive strength
• Good chemical resistance
• Low shrinkage during curing
• Good mechanical properties
• Improved thermal expansion absorbtion
• Very wide range of hardnesses
• Good thermal stability

Applications:

• Electrical encapsulation and insulation
• Improved damping properties
• High abrasion resistance
• Low temperature applications
• Very high heat conductivity
• High degree of elasticity